iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes
Published: |
May 13, 2021 |
Author: |
Haley Fu, Raiyo Aspandiar, Jimmy Chen, Shunfeng Cheng, Qin Chen, Richard Coyle, Sophia Feng, Mark Krmpotich, Ronald C. Lasky, Scott Mokler, Jagadeesh Radhakrishnan, Morgana Ribas, Brook Sandy-Smith, Kok Kwan Tang, Greg Wu, Anny Zhang, Wilson Zhen |
Abstract: |
The 2017 iNEMI Board and Assembly Roadmap forecasts that, due to economic, environmental and technical drivers, use of low temperature solder pastes will increase significantly and reach 10% of all solder paste used for board assembly by 2021.... |
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