Introducing the OSP Process as an Alternative to HASL

Published:

August 9, 1999

Author:

David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem

Abstract:

Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....

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Company Information:

A leading worldwide provider of complex multi-layer printed circuit boards (PCBs) and Electro-Mechanical Solutions to OEMs

St. Louis, Missouri, USA

Manufacturer

  • Phone 314-727-2087
  • Fax 314-746-2233

See Company Website »

Company Postings:

(2) technical library articles

(1) news release

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