Technical Articles From Metcal

Risk Mitigation in Hand Soldering

Jan 02, 2019 | Robert Roush

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them....

Hand Soldering with Lead Free Alloys

Feb 22, 2018 | Metcal

As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing process requiring additional research and development. Hand soldering tends to occur at the end of the process line where the circuit board has a high intrinsic value and so correct process control will have a significant affect on manufacturing costs and productivity.

This paper discusses the fundamental aspects of the hand soldering process and discusses process adaptation requirements for successful lead free implementation....

Rework Challenges for Smart Phones and Tablets

Apr 23, 2015 | Paul Wood Advanced Product Applications Manager APR/ BGA Products OK International / Metcal.

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive.

The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00....

Profiling for Successful BGA/CSP Rework

Aug 14, 2013 | Metcal

This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages....

Effective Qualification of Soldering Iron Performance Criteria

Nov 27, 2012 | Metcal

Quality managers and line supervisors are routinely tasked with the responsibility of ensuring that the hand soldering process is under control. The method most commonly used is to measure the idle tip temperature of the soldering station and to use this reading as a benchmark of system compliance. This method, although popular is now being seriously questioned by many industry professionals as being irrelevant in qualifying true system process control.

This document aims to present a practical view of what factors are important for successful hand soldering and to suggest an alternative procedure for qualification that is simple, repeatable and directly related to the effectiveness of the soldering station....

Increase Your Process Control and Lower Cost of Ownership

Nov 12, 2012 | Ed Zamborsky, Eastern Territory Sales Manager, OK International/Metcal

With consumers constantly looking for lower prices on their technology products and manufacturers trying to squeak out higher margins from their production lines, the need for process control and lower overhead costs have become even more important. One sector that is often overlooked is the hand soldering area of the factory. Many factories have been struggling with antiquated soldering systems for years. In some cases they are trying to make their investment in stations last much longer than they were designed for, or they are falsely trying to recoup their original investment ‐ all at the cost of higher operating expenses or even worse, reduced operator thru‐put....

Soldering Faster At Lower Temperatures: A Performance Comparison

May 09, 1999 | Doug Wilkerson, Technical Services Manager.

Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers. ...

Hand Soldering, Electrical Overstress, and Electrostatic Discharge

May 09, 1999 | Ron LaValley, Edwin Oh

This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems....

Extending Soldering Iron Tip Life

May 09, 1999 | Metcal

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one....

Surface Mount Rework Techniques

May 09, 1999 | Brian Moylan

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices. ...