Technical Articles From Siemens Process Industries and Drives
Read technical articles about electronics manufacturing added by Siemens Process Industries and Drives
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6 technical articles added by Siemens Process Industries and Drives
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Failure Mechanisms Of Electromechanical Relays On PCBAs: Part I
Sep 15, 2021 | Gert Vogel
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering....
Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.
Jan 21, 2009 | Gordon Christison
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology....
Simple, Effective Process Control in Wave Soldering
Jun 23, 1999 | Chrys Shea
This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time....
Optimizing the Wave Soldering Process with Hot Nitrogen Knives
Apr 29, 1999 | Chrys Shea, Siemens, & Gary Shipe, Air Products
The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests....
VOC-Free Wave Solder Flux Evaluation
Apr 26, 1999 | Chrys Shea, Siemens ICN
The goal of the flux evaluation was to identify one product that would meet the needs of all SICN's wave solder products and processes while producing high quality assemblies. At the outset of the evaluation, it was unclear whether a single flux chemistry could satisfy such a broad range of demands, particularly because SICN's utilization of less aggressive, low-impact chemicals....
The Characterization and Comparison of Spray Fluxers
Apr 26, 1999 | Chrys Shea & Tom Chinnici, Siemens Business Communication Systems, Inc., Originally published at Nepcon West '98
An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results....
