Technical Articles From Electronics
Read technical articles about electronics manufacturing added by Electronics
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1 technical article added by Electronics
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Assembly and Rework of Lead Free Package on Package Technology
Mar 22, 2012 | Raymond G. Clark, Joseph D. Poole, TT Electronics - IMS
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha...
