Technical Articles From DDM Novastar Inc
Read technical articles about electronics manufacturing added by DDM Novastar Inc
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2 technical articles added by DDM Novastar Inc
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Horizontal Convection Reflow Technology Defined
Dec 23, 2009 | APS Novastar
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering....
How to Profile a PCB
Apr 22, 2009 | P. John Shiloh, John Malboeuf.
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process....
