Technical Articles From Viasystems Group, Inc.
Read technical articles about electronics manufacturing added by Viasystems Group, Inc.
- SMTnet
- »
- Technical Library
- »
- Contributors
- »
- Articles from Viasystems Group, Inc.
2 technical articles added by Viasystems Group, Inc.
Company Information:
Alternatives to HASL: Users Guide for Surface Finishes
Aug 09, 1999 | Dan T. Parquet and David W. Boggs, Merix
A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate....
Introducing the OSP Process as an Alternative to HASL
Aug 09, 1999 | David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements....
