Technical Articles From Electronic Packaging Laboratory, State University of New York
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1 technical article added by Electronic Packaging Laboratory, State University of New York
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Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC: A Computational Model
Jun 13, 2013 | Wei Yao, Cemal Basaran
Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry......
