Technical Articles From XYZTEC bv
Read technical articles about electronics manufacturing added by XYZTEC bv
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2 technical articles added by XYZTEC bv
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Mechanical stress test for component solder joints and bonding wires
Aug 24, 2016 | MINIMOTOR Benelux
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device....
Bond Test Measurement Accuracy
Aug 23, 2016 | Bob Sykes
While many things can affect the force measurement accuracy of a bond test, its ultimate limitation is that of the force sensor. With advances in technology, accuracy can be dramatically improved with no cost penalty and no need to select force measurement ranges. How is this accomplished? ...
