Mar 02, 2015 The SMTA is pleased to announce the program for the 9th Annual International Conference on Soldering and Reliability being held May 19-21, 2015 in Markham, Ontario, Canada. The event will be co-located with the SMTA Toronto Expo.
The technical conference features 28 presentations on topics including lead-free solders, materials as different as graphene, nanofibers and coatings, stencils for disparate-sized components, and prevention of defects like tin whiskers and head-in-pillow. Speakers represent companies including BAE Systems, Celestica, Creation Technologies, Intel Corporation, Jabil Circuit, Rockwell Collins, Verdant Electronics, and schools including University of Singapore, University of Waterloo, University of Toronto, and SUNY Binghamton.
On Wednesday, May 20, Bill Bader, CEO of iNEMI, will deliver the Keynote Presentation on "Electronic Industry Collaboration - Critical 21st Century Supply Chain Tools."
Half-day workshops on Tuesday, May 19, will include:
- Effective Strategies for Selecting and Qualifying Assembly Process Material
- Manufacturing Wrong: Case Studies in Nonconformance
- Electrochemical Migration and Conductive Anodic Filament (CAF) Formation
- Ruggedization with Focus on Conformal Coating
The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on Thursday, May 21. Conference participants may attend the expo for no charge. Complimentary technical presentations will be offered throughout the day. Check online for more details and the agenda.
The Early Bird registration deadline is April 17th. For more information or to register visit: http://www.smta.org/icsr
Contact Patti Coles at 952-920-7682 or patti@smta.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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