Apr 16, 2015 The Surface Mount Technology Association (SMTA) has issued a call for papers for the 2016 Pan Pacific Microelectronics Symposium, which will be held 25 - 28 January 2016 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly.
The esteemed technical and advisory committees are planning the most robust conference to date with new technical tracks covering even greater depth of research.
The deadline for abstracts is June 15, 2015. Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed below.
Featured topics include:
- 3D/Heterogeneous Integration
- Emerging Technologies
- Green Electronics
- High Performance Low I/O
- Material Advances
- Nanotechnology
- Reliability, Health/Prognostics
- Strategic Direction/ Industry Roadmaps
Please submit abstracts of 500 words with title and author contact information to Tanya Martin, tanya@smta.org, or online at http://smta.org/panpac/call_for_papers.cfm.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
»
