Aug 06, 2015 The SMTA announced that the Harsh Environments Symposium will once again run for a day and a half from Monday, September 28 until Tuesday, September 29, 2015 at SMTA International in Rosemont, Illinois.
Organized by Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, John Evans, Ph.D. and Pradeep Lall, Ph.D., Auburn University, the Harsh Environments Symposium addresses the concerns related to harsh environment electronics and the challenges within the electronics community. It is intended to bring together the needs of "end-users" with the capabilities of the research community and the industrial supply base. Specifically, the Symposium addresses the challenges of meeting expanding temperature ranges (-55C to +200C) with increased vibration, higher package density and longer reliability. Next generation requirements are explored from the system level and potential supply-based solutions are presented.
Session topics include Reliability of Components in Harsh Environments, Electronics in Corrosive Environments, Materials for Harsh Environments, Electronics Ruggedization Through Coating, and Thermal Management. Papers will be presented by speakers from 3M, Auburn University, Honeywell, IBM Corporation, Intel, National Physical Laboratory, Northrop Grumman, Qualcomm, Samsung, Schoeller Electronics, University of Texas - Arlington, University of Rostock and Western Digital, among others.
Jim Springer, John Deere Electronic Solutions, will present “”Extreme Environment Electronics - Where We've Been, Where We Are Going and What Could Be Next” during the Keynote Lunch on Monday.
Details of the Harsh Environments Symposium can be found at http://www.smta.org/smtai/symposium.cfm#he or contact Tanya Martin: 952-920-7682 or tanya@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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