Technical tracks will cover the Technical Innovations Symposium, Harsh Environments Symposium, Lead-Free Soldering Technology Symposium, Advanced Packaging Technology; Manufacturing for Excellence - process and assembly; Substrates/PCB Technology; Flux, Solder and Adhesives; and Inspection Technologies. Engineers from major manufacturing companies such as Celestica, Collins Aerospace, Flex, Harris, IBM, Intel, Jabil, Nokia Bell Labs, NXP Semiconductors, Raytheon, Rockwell Automation, several universities and more will present their latest research on critical process improvements, new materials and technologies.
Fifteen half-day professional development courses are offered Sunday and Monday from expert instructors on topics including Design, Stencil Printing, Soldering Profiles, Process Troubleshooting, Solder Joint Reliability, Reflow, Wave Soldering, Defect Analysis, Cleaning, Bottom Termination Component (BTC) issues, and more.
Over 160 exhibiting companies will display equipment, materials, and services at the Electronics Manufacturing Exhibition, which will be held Tuesday and Wednesday, September 24 - 25. Attendees are invited to join the “Meetings to Greetings Reception” which will be held Wednesday, September 25.
Several events at SMTA International are free to all attendees including Jump Start 101 Technical Sessions covering printing, placement, reflow, inspection, X-Ray, and cleaning. Other complimentary events available to all attendees are the Women’s Leadership Program, Autonomous Lawn Mower feature area, Fun Run, “Meetings to Greetings” Reception, Poster Session as well as various professional development and career resources for students and young professionals.
The early registration deadline is August 30, 2019. For full details and to register for SMTA International, visit https://www.smta.org/smtai or contact SMTA Executive Director Tanya Martin: 952-920-7682 or tanya@smta.org.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.