Dec 11, 2019 SMTA announced that the program is finalized for the 25th Annual Pan Pacific Microelectronics Symposium. The event will take place February 10-13, 2020 at the Westin Hapuna Beach Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Advanced Packaging and Processing, Advanced Materials, Electrochemical Migration & Creep Corrosion, Printed Electronics, Reliability, Roadmaps, Smart Factory/i4.0, Test Methods and more.
On the afternoon of Monday, February 10, a plenary session will kick off the event featuring presentations on Advances in Power Electronics, Healthcare Gaps That Only Technology Can Fill, The Origins of Silicon Valley, as well as a special presentation of Astronomy Future Cast by the Mauna Kea Observatory.
On Tuesday, February 11, Eric Fossum, Ph.D., Thayer School of Engineering, Dartmouth College, will deliver the keynote lunch talk on “The Invention of CMOS Image Sensors: A Camera in Every Pocket.”
On Wednesday, February 12, John Quackenbush, Ph.D., Harvard University, will deliver the lunch keynote on “Using Healthcare Data to Advance Precision Medicine.”
Ricky Lee, Ph.D,, HK UST, will deliver the final keynote lunch presentation about “Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging with Multi-layer RDL” on Thursday, February 13.
View the complete program and register at: https://www.smta.org/panpac. Please contact Tanya Martin, tanya@smta.org or +1-952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Karlie Severinson, karlie@smta.org, for details.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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