Feb 07, 2003
The presentations will be broadcasted using telecon for the audio and Web file downloads for the presentation materials. E-mail hyperlinks will also be available during presentations to submit questions directly to the instructor.
On Friday, February 28, from 10:30 a.m. to noon (Eastern US), Tom Borkes of The Jefferson Project will present "A Statistical Approach To 0201 Component Usage." This presentation will provide an in-depth analysis of the 0201 component package and the corresponding assembly processes that are required to successfully use this package in production.
On Friday, March 14, from 10:30 a.m. to noon (Western US), Solectron vice president technology Srinivas Rao will present "Dealing With The Black Pad Defect." This presentation will focus on the methodology for characterizing "black pad defect" and can serve as a practical user's guide for determining if a failure is related to the black pad defect.
On Friday, April 4, from 11:30 a.m. to 1 p.m. (Eastern US), Ken Gilleo, Ph.D. of Cookson Electronics will present "A Smorgasbord Of Emerging Packaging Technologies." This presentation will review and update the exciting Package Revolution, describing packages that were, those that are and some that are only dreams.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations. For more information, visit http://www.smta.org.
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