SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced

International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced

Dec 17, 2009

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."

The paper was selected based on the following criteria:

  • Technical paper must be provided (if speaker submitted an abstract only he/she does not qualify)

  • Must be original work - rehash of previously reported work does not qualify

  • Must include data - data can include application, design rules / modeling, technical data including mechanical dimensions for test vehicles, design of experiments matrix, assembly or reliability data.

  • Work must be pertinent to the industry, IWLPC and SMTA objectives

The paper can be found on the conference proceedings, and is available for purchase in the SMTA BookStore on-line at http://www.smta.org/store/book_store.cfm.

Plans are underway for the 2010 conference. Lee Smith, Amkor Technology, will act as technical Chair. Ken Gilleo, ET-Trends LLC, will be the General Chair. New members of the technical committee are Francoise von Trapp, 3D Incites, and Ron Edgar, Chip Scale Review.

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

For more information contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org.

Visit http://www.iwlpc.com to view the full program and watch for a complete event review.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

May 27, 2022 -

Symposium on Counterfeit Parts and Materials Program Finalized

May 18, 2022 -

SMTA Capital Chapter Expo - Advanced Manufacturing on Supply Chain Solutions

May 05, 2022 -

SMTA Announces Technical Program for International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Apr 13, 2022 -

SMTA Capital Chapter's Expo and Tech Forum to be Held on May 24th

Apr 13, 2022 -

Upcoming SMT Processes Certification Dates in North America

Feb 25, 2022 -

SMT Processes Certification, Harsh Environments Conference Coming to Amsterdam

Feb 16, 2022 -

Seeking Student Applications for 2022 Stromberg Scholarship

Feb 10, 2022 -

2022 Charles Hutchins Grant Now Open for Applications

Jan 10, 2022 -

Dr. Vahid Akhavan, NovaCentrix, to Present at SMTA Capital Chapter Meeting on January 20th

Dec 21, 2021 -

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

685 more news from Surface Mount Technology Association (SMTA) »

Jul 06, 2022 -

Offline PCBA Cleaning Machine HJS-7100,rosin flux, non-clean flux,water-soluble flux cleaning machine

Jul 05, 2022 -

Semiconductor Spray Cleaning Machine HJS-9700,Semiconductor Wafer Cleaning Machine HJS-9700

Jul 04, 2022 -

Pneumatic Stencil Cleaner HJS-9000II,dual chamber stencil cleaning machine

Jul 03, 2022 -

Electric Stencil Cleaner HJS-9500, SMT Electric Stencil Cleaner HJS-9500

Jul 01, 2022 -

Screen Cleaning Machine HJS-4600, SMT Screen Cleaning Machine HJS-4600

Jun 30, 2022 -

Electric Fixture Cleaning Machine HJS-6700, SMT pallet cleaning machine, soldering pallet cleaning machine

Jun 29, 2022 -

Waste Water Treatment Machine RWT-1000, SMT Waste Water Treatment Machine RWT-1000

Jun 28, 2022 -

Gen3's Dr Chris Hunt, CTO submits an insightful paper to the journal of Surface Mount Technology

Jun 28, 2022 -

Squeegee Cleaning Machine HJS-3700,SMT Squeegee Cleaning Machine HJS-3700

Jun 27, 2022 -

Solderstar Celebrates 20 Years of Innovation

See electronics manufacturing industry news »

International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced news release has been viewed 463 times

  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced
Benchtop Fluid Dispenser

Reflow Oven