SMTA Announces Pan Pacific Symposium Call for Papers

Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010. Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed below.

3D Technologies

• Package on Package (PoP)

• Thru Si Vias (TSV)

• Module Stacking

• Origami Flex Packages

• Shaped Circuits

• Build Up/Blind & Buried Via PWBs

• Cu Pillars & Posts

• Si Interposers

• MCM/SiP Advances

Lighting & Displays

• LED Packaging & Assembly

• Compact Fluorescent Systems

• OLED Developments

• Display Drivers

• Chip on Glass (CoG)

• MEMS/MOEMS

• Flat Panel Processes

Materials Advances

• Nano Materials Applications

• Thin & Thick Film Systems

• Pb & Halogen Free

• Thermal Management

• Phosphors & Light Absorption

• Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)

• Integrated Passive Devices

• Embedded Approaches (Passive & Actives)

• Failure Analysis and Reliability

Renewable Energy Technologies

• Photovoltaics

• Power Control/Conversion/Distribution

• Green Manufacturing

• Power Packaging

• Environmental Impact Analysis

• Solar Thermal Conversion

• Large Area/Module Assembly

Strategic Direction

• Supply Chain & Operations Management

• Economics & Cost Analysis

• Trends, Forecasts & Roadmaps

• Penetration Strategies

• Technology Drivers

• Health & Prognostics

• Manufacturing Management & Control

Please submit abstracts of 500 words with title and author contact information to JoAnn Stromberg, joann@smta.org, or online at http://smta.org/panpac/call_for_papers.cfm.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.