Oct 09, 2018 Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Kester’s booth will offer attendees the opportunity to learn more about new products including: NP505-LT Solder Paste, The Paste Designed for Low Temperature Applications; NP560 Solder Paste, The Ultra-Low Voiding Paste under QFNs; and WP616 Solder Paste, The Zero-Halogen Chemistry for Water-Soluble Applications as well as Kester’s High Reliability Product Line.
In addition to exhibiting, Kester will chair two technical sessions and will present the following four papers:
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Monday, October 15 at 3:30pm: Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering Applications
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Tuesday, October 16 at 2:30pm: Rheology of Flux and Solder Paste II: Shelf Life Study
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Wednesday, October 17 at 8:30am: Selective Soldering Design for Reliability Using a Novel Test Board and SIR Test Method
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Wednesday, October 17 at 2:30pm: Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – DoE Tests
To learn more about these sessions, please visit https://www.smta.org/smtai/SMTAI-2018-Conference-Program.pdf?v=181009101024.
To schedule an appointment with a member of our R&D or sales team or if you have any questions, please contact Michelle O’Brien at mobrien@kester.com.
