News Releases from Indium Corporation
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357 news releases added by Indium Corporation
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Indium Corporation, KATEK to Present Joint Process Development at SMTconnect
May 05, 2022 | Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.
Indium Corporation Experts to Present at PCIM e-Mobility Forum
Apr 28, 2022 | Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May 10-12, Nuremberg, Germany.
Indium Corporation Expert to Present at Electronic Components and Technology Conference
Apr 28, 2022 | Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Indium Corporation Expert to Present at SiP Conference China
Apr 28, 2022 | Indium Corporation®'s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Indium Corporation to Present on e-Mobility at SMTA Michigan
Apr 20, 2022 | Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.
Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications at PCIM Europe
Apr 20, 2022 | Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.
Indium Corporation's Dr. Ron Lasky to Present on Design of Experiments in Upcoming Webinar
Apr 13, 2022 | Indium Corporation's Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company's popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.
Indium Corporation President to Deliver TestConX Keynote on Materials Science Innovations
Apr 13, 2022 | Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.
Indium Corporation's Dr. HongWen Zhang to Present InSIDER Series Webinar
Apr 06, 2022 | Indium Corporation's Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company's award-winning Durafuse™ mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse™ Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Sixteen Indium Corporation¬ Experts Certified by SMTA
Apr 06, 2022 | Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through professional development.
Indium Corporation to Present on e-Mobility at SMTA Atlanta
Mar 25, 2022 | Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Atlanta Expo & Tech Forum at 10:30 a.m. local time, Tuesday, April 20, Peachtree Corners, Ga., U.S.
EV Experts to Share Technical Insights with Driving e-Mobility: Rel-ion™ Technical Webinars
Mar 25, 2022 | As part of its popular InSIDER Series of webinars, Indium Corporation is excited to launch a new series focusing on the opportunities and challenges present in the rapidly evolving electric vehicle market, Driving e-Mobility: Rel-ion™ Technical Webinars.
Indium Corporation Expert to Present at SEMI-THERM
Mar 09, 2022 | Indium Corporation's Miloš Lazić, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications at SEMI-THERM, March 21-25, San Jose, Calif., U.S.
Indium Corporation Introduces Liquid Flip-Chip Flux
Mar 09, 2022 | Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.
Indium Corporation to Present on e-Mobility at SMTA Rocky Mountain
Feb 25, 2022 | Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Rocky Mountain Expo & Tech Forum, Thursday, March 10, Denver, Colo., U.S.
Indium Corporation Expert to Present at APEC
Feb 10, 2022 | The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation Announces Personnel Updates at Clinton Facility
Jan 29, 2022 | Indium Corporation is pleased to announce several personnel updates at the company's facility located on Robinson Road in Clinton, New York.
Indium Corporation Expands Fine Wire Capabilities
Jan 29, 2022 | Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Indium Corporation Expert to Present at IEM
Jan 29, 2022 | Durafuse™, Indium Corporation's award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers, Malaysia at 8 a.m. New York/9 p.m. Malaysia on Thursday, Feb. 24.
Indium Corporation Senior Technologist's Knowledge Showcased at SMTA PanPac
Jan 10, 2022 | Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
Indium Corporation's Brian O'Leary Accepts 'Global Head of e-Mobility & Infrastructure' Role
Dec 21, 2021 | Indium Corporation is pleased to announce that Brian O'Leary has accepted a new role as Global Head of e-Mobility & Infrastructure in addition to his current position as Global Accounts Manager.
Indium Corporation to Present at SPIE Photonics West
Dec 17, 2021 | One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.
Indium Corporation Introduces New Water-Soluble Flux-Cored Wire
Dec 07, 2021 | Indium Corporation announces that it is now offering CW-305, a uniquely formulated flux-cored wire that offers superior ease of cleaning in which the post-soldering residue can be removed by using only a warm water-wash.
Indium Corporation Honored as Global Leader in 'Solder and Materials' with BETA Award
Dec 01, 2021 | Indium Corporation was awarded one of BISinfotech's coveted 2021 BETAs (BISinfotech Excellence and Technovation Awards) as a global leader in the Solder and Materials category during a virtual ceremony on Nov. 30.
Indium Corporation Expert to Present at IMPACT
Nov 24, 2021 | Durafuse™ LT, Indium Corporation's award-winning low-temperature alloy technology, will be the focus of a presentation by Dr. HongWen Zhang at the International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT), Dec. 21-23, Taipei, Taiwan.
Indium Corporation Experts to Present at EPTC
Nov 22, 2021 | Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.
Indium Corporation Expert to Participate in Nordson Roadshow
Nov 12, 2021 | Indium Corporation's Andreas Karch, regional technical manager and technologist – advanced applications, will be a special guest at Nordson's roadshow and knowledge-expanding Tech Talks event at its Test and Inspection Solution Center in Feldkirchen, Munich, Germany.
Indium Corporation to Present at PCB Carolina
Oct 28, 2021 | Indium Corporation's Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at PCB Carolina on Nov. 10 in Raleigh, N.C., USA.
Indium Corporation Expert to Present at LED Meets SMT
Sep 30, 2021 | Indium Corporation's Andreas Karch, regional technical manager and technologist – advanced applications, will present on thermal management at EPP's specialist forum: LED Meets SMT.Karch will present at 3:15 p.m. (Germany) on Oct. 21in Regensburg, Germany.
Indium Corporation Offers 'Back to School' SMT IQ Test
Sep 30, 2021 | Class is in session once again as Indium Corporation offers a new round of its successful test for industry professionals to measure their surface mount technology (SMT) knowledge. Organized byDr. Ron Lasky, senior technologist, the test offers prizes--and bragging rights--to those who get a high score.
Indium Corporation Expert to Present at SiP Conference China
Aug 28, 2021 | Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Indium Corporation to Present Power Module Poster at PCIM Asia
Aug 26, 2021 | Indium Corporation's Leo Hu, senior area technical manager – East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.
Indium Corporation Expert to Share Market Insights at MMTA International Minor Metals Conference
Aug 26, 2021 | An Indium Corporation expert will share her expertise on the global indium market at the 2021 Minor Metals Industry Summit, September 13-14, Changsha, Hunan Province, China.
Indium Corporation Announces New Versatile Solder Paste
Aug 13, 2021 | Indium Corporation introduces Indium 12.8 HF as it continues to develop innovative solder paste solutions to meet customers' current and emerging needs. Indium 12.8 HF is a versatile paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Indium Corporation Announces SMTA South China Presentations
Aug 13, 2021 | Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.
Indium Corporation Announces Spanish-Language Printing Webinar
Jul 27, 2021 | Indium Corporation's Iván Castellanos, technical services manager for Latin America, will host two sessions of an InSIDER Series webinar on the basics of reflow profiling. The first session will be on Tuesday, Aug. 17 at 3 p.m. Central/4 p.m. Eastern, followed by the second session on Thursday, Aug. 19 at 3 p.m. Central/4 p.m. Eastern.
Elements of Indium by Indium Corporation: Cold Welding
Jul 22, 2021 | At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
Indium Corporation Expert to Host iNEMI Roadmap Webinar
Jul 19, 2021 | Indium Corporation's Dr. Ron Lasky, senior technologist, will host a webinar comparing past iNEMI roadmap predictions with their outcomes on Thursday, Aug. 10 at 7 a.m. San Francisco/10 a.m. New York/3 p.m. London as part of the company's free webinar program, the InSIDER Series.
Indium Corporation Introduces New Hand Soldering, Rework Flux
Jul 19, 2021 | Indium Corporation has released TACFlux®571HF, a new no-clean, halogen-free flux formulated for both hand soldering and rework.
Indium Corporation Expert to Host Weibull Analysis Webinar
Jul 02, 2021 | Indium Corporation's Dr. Ron Lasky, senior technologist, will host a webinar on the fundamentals of Weibull distribution and analysis on Thursday, July 29 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London on Indium Corporation's webinar program, the InSIDER Series.
Indium Corporation to Feature High-Reliability Products at CEIA Wuhan
Jun 17, 2021 | Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Indium Corporation Experts to Present at ICEHET
May 18, 2021 | Two of Indium Corporation's experts will present in the virtual International Conference for Electronics Hardware Enabling Technologies(ICEHET) virtual conference, hosted by SMTA Toronto, June 2-3.
Indium Corporation Expert to Present at ICEP
Apr 29, 2021 | Indium Corporation's Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.
Elements of Indium by Indium Corporation: Liquid Gallium-Indium
Apr 15, 2021 | At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series--an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.
Indium Corporation Experts to Present at IMAPS Device Packaging Virtual Conference
Mar 30, 2021 | Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.
Indium Corporation to Feature Low-Temp Alloy at Productronica China
Mar 06, 2021 | Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 inShanghai, China.
Indium Corporation to Feature New Flux-Cored Wire at IPC APEX Expo
Feb 25, 2021 | Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12.
Indium Corporation Introduces New Fast-Wetting, Low-Spatter Flux-Cored Wire for Robotic and Laser Soldering
Jan 21, 2021 | Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.
Indium Corporation Announces Ultrafine Dispensing Webinar
Jan 17, 2021 | Indium Corporation's Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Serieswebinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.
Indium Corporation Expert to Present for IEEE EPS Webinar Series
Dec 10, 2020 | Indium Corporation's Dr. Hong Wen Zhang, R&D Manager, Alloy Group, will share his industry expertise during the IEEE Electronics Packaging Society (EPS) Malaysia Chapter Webinar Series at 9 a.m. Malaysia Time, Wednesday, Dec. 16 (8 p.m. Eastern Time, Tuesday, Dec. 15).
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