News Releases from Indium Corporation
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357 news releases added by Indium Corporation
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Indium Corporation's Proven Jetting Paste Recommended by NSWAutomation
Dec 03, 2020 | Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.
Indium Corporation Expert to Present IMAPS Webinar
Dec 01, 2020 | Indium Corporation's Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
Indium Corporation Expert to Participate in Miniaturization Round table
Nov 24, 2020 | Indium Corporation's Adam Murling, Technical Support Engineer, will participate in a virtual miniaturization round table hosted by BarTron on Thursday, Dec. 10 at 10 a.m. Eastern Time (3 p.m. British Time/11 p.m. Malaysia Time).
Indium Corporation Expert to Participate in Low-Temperature Solders Debate
Nov 23, 2020 | Indium Corporation's Chris Nash, Product Manager, PCB Assembly Solder Paste, will participate in a Global SMT & Packaging debate on low-temperature solders on Tuesday, December 8 at 10:30 a.m. Eastern Time (3:30 p.m. British Time/11:30 p.m. Malaysia Time).
Indium Corporation Expert to Participate in Online Thermal Conference
Nov 09, 2020 | Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS'sonline thermal management conference from Nov. 25-26.
Indium Corporation Strategic Partnership with RENEX Group
Nov 03, 2020 | Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in Poland.
Indium Corporation Expert Presented atHigh-Density Assemblies Webinar
Oct 31, 2020 | Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, participated in a soldering-focused webinar hosted by MELSS on Thursday, October 15.
Indium Corporation's Durafuse™LT EarnsMexico Technology Award
Oct 31, 2020 | Indium Corporation earned the Mexico Technology Award for its patent-pending Durafuse™ LT low-temperature alloy system.
Indium Corporation Receives Electronics Maker's Best of Industry Award
Oct 29, 2020 | Indium Corporation earned Electronics Maker's Best of Industry Award for 'Excellence in Electronics Assembly Materials' on Thursday, October 15 during a virtual ceremony.
Indium Corporation Expert to Present at EPP Innovations FORUM Germany
Oct 14, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the virtualEPP InnovationsFORUM Germanyon Oct. 28 at 12:05p.m.Central European Time.
Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo
Oct 14, 2020 | Indium Corporation'sAnson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.
Indium Corporation Expert to Host High-Density Assemblies Webinar
Oct 04, 2020 | Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, will host an InSIDER Series webinar regarding the implementation of high-density assemblies in electronic products on Tuesday, October 13 at 8 a.m. New York Time (1 p.m. British Time/8 p.m. Malaysia Time).
Indium Corporation AnnouncesAutomotive Electronics Assembly and Packaging Webinar
Oct 04, 2020 | Indium Corporation'sAndy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020at 9:30 a.m.Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13/2:30 a.m.British Time on Oct. 13).
Indium Corporation Experts to Present at IMAPS
Sep 10, 2020 | Two Indium Corporation experts will present technical content during IMAPS International Symposium on Microelectronics, a global virtual event, Oct. 5-8.
Indium Corporation Announces Spanish-Language Voiding Workshop Webinar
Sep 06, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar
Aug 28, 2020 | Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) on Thursday, Sept. 17.
Indium Corporation Expert to Host Electronic Assembly Reliability Webinar
Aug 22, 2020 | Indium Corporation's Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will host an InSIDER Series webinar focused on solder paste attributes and their impact on increased product service life reliability requirements. The webinar will be presented on Webex, Wednesday, Sept. 2 at 9 a.m. Eastern Time (2 p.m. British Time/9 p.m. Malaysia Time).
Indium Corporation to Host PCB and Component Defects Webinar
Aug 22, 2020 | Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Indium Corporation Announces Chinese Webinar Series
Aug 07, 2020 | Indium Corporation now offers Chinese-language webinars as part of its InSIDER Series program. The first Chinese webinar of the series was recently hosted by Dr. Ning-Cheng Lee, Vice President of Technology, who discussed defect elimination in thermal management.
Indium Corporation and KYZEN Experts to Host Cleaning No-Cleans Webinar
Jul 22, 2020 | Indium Corporation's Brian O'Leary, Global Accounts Manager, will partner with KYZEN's Debbie Carboni, Global Product Line Manager, Electronics, to present an InSIDER Series webinar on cleaning no-cleans. There will be two sessions of the webinar--Tuesday, August 4 at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) and Wednesday, August 5 at 5:30 a.m. Eastern Time (10 a.m. British Time/5:30 p.m. Malaysia Time).
Indium Corporation Expert to Host 5G Connectivity Webinar
Jul 22, 2020 | Indium Corporation's Jenny Gallery, Product Specialist, will host a webinar focused on gold-based thermal solutions for 5G connectivity. There will be two sessions on Wednesday, Aug. 5, during International Microwave Symposium's (IMS) virtual conference. The first session will be held at 8 a.m. Eastern Time (1 p.m. British Time/8 p.m. Malaysia Time), with the second at 2 p.m. Eastern Time (7 p.m. British Time/2 a.m., Aug. 6, Malaysia Time).
Indium Corporation Releases Report on Indium, Gallium Availability
Jul 22, 2020 | Indium Corporation has released a report on the worldwide availability of indium and gallium metal.
Indium Corporation Receives EM World's Innovation Award
Jul 22, 2020 | Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its low-temperature alloy technology, Durafuse™ LT. The award was presented on Friday, July 3, in Shanghai, China, during Productronica China.
Indium Corporation's Dr. Lee Co-Authors Book on Lead-Free Assembly
Jul 14, 2020 | Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.
Indium Corporation Announces Spanish-Language Low-Temperature Solder Webinar
Jul 07, 2020 | Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an InSIDER Series webinar focused on the company's innovative low-temperature solder offering on July 21 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Indium Corporation Expert to Host Power Electronics Webinar
Jun 18, 2020 | Indium Corporation's Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will host a power electronics webinar featuring InFORMS® as part of Indium Corporation's InSIDER Series on Webex at 11 a.m. EST on Tuesday, June 23.
Indium Corporation Announces Low-Temp Solder Webinars
May 12, 2020 | Indium Corporation's Claire Hotvedt, Product Development Specialist, will host two InSIDER Series webinars focused on the company's innovative low-temperature solder offering on May 12 at 2 p.m. and May 13 at 8 a.m. EST.
Indium Corporation’s Vareha-Walsh to Share Insights at World Congress of Smart Materials 2020
Jan 10, 2020 | Indium Corporation’s Donna Vareha-Walsh, Director of Sales and Global Supply Chain and Trade Compliance, will share her industry expertise at the 6th Annual World Congress of Smart Materials 2020, March 11-13, 2020, in Barcelona, Spain.
Indium Corporation’s Industry Partners to Feature ‘Live@Productronica’ Demonstrations
Nov 12, 2019 | Indium Corporation’s industry partners will feature its proven products live on the show floor during Productronica from November 12-15, in Munich, Germany as part of the company’s “Live@Productronica” program.
Indium Corporation Launches IndiTri™—High-Purity Indium Trichloride
Apr 23, 2019 | IndiTri™ is Indium Corporation's proven high-purity indium trichloride (InCl3) compound that delivers a consistent percentage of indium with a wide range of applications.
Indium Corporation Earns International Automotive Quality Recognition at Solder Manufacturing Facilities
Apr 17, 2019 | Indium Corporation has earned IATF 16949:2016 management system certificates for five of its solder manufacturing facilities in Clinton and Utica, NY, USA; Singapore; Milton Keynes, UK; and China. The company’s headquarters in Clinton, NY, USA has also achieved IATF 16949 certification.
Indium Corporation Features New InFORMS® Solution for Die-Level Bonding at PCIM 2019
Apr 15, 2019 | Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Indium Corporation’s Vareha-Walsh to Present at SVC TechCon
Apr 14, 2019 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will present at SVC TechCon 2019, April 30-May 1, Long Beach, California, USA.
Indium Corporation Celebrates 85 Years of Technology Innovation and Growth
Mar 18, 2019 | Indium Corporation employees around the world joined in celebrations today to mark the company’s 85th anniversary.
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019
Feb 09, 2019 | Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz.
Indium Corporation Launches New Water-Soluble, Halogen-Free Solder Paste
Feb 06, 2019 | Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Indium Corporation Actively Engaging Attendees on the 2019 IPC APEX Expo Show Floor
Jan 23, 2019 | Indium Corporation will give IPC APEX Expo conference attendees numerous opportunities to witness the company’s proven products live on the show floor, as well as an opportunity to meet with their voiding experts, from Jan. 29-31 in San Diego, California, USA.
Indium Corporation Names Silver Quill Award Winners
Jan 16, 2019 | Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award
Jan 15, 2019 | Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.
Indium Corporation Experts to Present at Pan Pacific Microelectronics 2019
Jan 12, 2019 | Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Indium Corporation Experts to Present at IPC APEX Expo
Jan 08, 2019 | Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Indium Corporation’s Mackie to Speak at TechSearch International Workshop
Dec 21, 2018 | Indium Corporation’s Andy Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will share his expertise at a TechSearch International’s workshop on Packaging for Automotive Electronics: Meeting Reliability Challenges for ADAS and Electronic Vehicles, Feb. 12-13, 2019, in Austin, Texas.
Indium Corporation Expert to Present at ELEXCON 2018
Dec 18, 2018 | Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West
Dec 16, 2018 | Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.
Indium Corporation’s Vareha-Walsh Presents at Global Minor Metals Trade Association (MMTA) Event in China
Dec 16, 2018 | Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China.
Indium Corporation’s Indium10.1HF Solder Paste Wins Mexico Technology Award
Nov 27, 2018 | Indium Corporation earned the Mexico Technology Award for its Indium10.1HF Solder Paste. The Mexico Technology Awards, sponsored by Mexico EMS, recognizes the best electronics manufacturing innovations in the electronics manufacturing industry in Mexico produced by OEM manufacturing equipment and materials suppliers over the last year.
Indium Corporation to Feature Indium8.9HF Solder Paste at IPC APEX EXPO 2019
Nov 14, 2018 | Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Indium Corporation VP of Technology to Lead Professional Development Course at EPTC 2018
Nov 07, 2018 | Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Indium Corporation Experts Honored With Best Paper Award at IMPACT 2018
Oct 27, 2018 | Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop
Oct 25, 2018 | Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.
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