ASC International, a leading manufacturer of 3-D solder paste inspection (SPI) and automated optical inspection (AOI) systems, today announced that it will exhibit in Booth #140 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL.
ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions. The VisionPro M500, VisionPro AP500, VisionPro AV862 and LineMaster DM will all be available on the show floor for hands-on presentations.
The VisionPro Series of SPI systems incorporates the most advanced, rapid 3D inspection technology coupled with an intuitive Windows® 7 OS and packaged in a rugged, bench-top or standalone platform. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M, AP and DM series an exceptional value for electronics manufacturers concerned with improving quality and production yields.
The VisionPro Series of AOI systems incorporates the most advanced, 2D high resolution sensing technology coupled with an intuitive Windows® 7 OS and packaged in a rugged, standalone platform. Both image comparison and algorithm based defect detection software provide ease of programming with reliable, low false call rates to maximize performance. The VisionPro AV series offers outstanding ROI with prices starting as low as $25,000!
Since its foundation in 1992, ASC International has become a leading supplier of AOI and SPI systems and custom sensor technology integration. Headquartered in Minneapolis, Minnesota, ASC International provides customers with the service and support needed to realize the value of their investment in inspection and process control systems. ASC International’s customers include world-class organizations like Celestica, Creation Technologies, Flex, Honeywell, Jabil, Lockheed Martin, Plexus, Rockwell Automation and Sanmina-SCI to name just a few. For more information, visit www.ASCInternational.com.