Feb 21, 2014 In the global electronics manufacturing marketplace, industry standards are critical in helping negotiate business. IPC APEX EXPO® will advance many of the standards the PCB manufacturing and assembly industries rely on when it hosts more than 90 standards development committee meetings, March 23–27, 2014, at the Mandalay Bay Convention Center in Las Vegas. Electronics industry professionals with interest and technical expertise in key areas are encouraged to attend.
Facilitated by representatives from OEMs, PCB manufacturers, EMS providers, design firms and other organizations, IPC committees develop the standards that provide form, fit and functional requirements, guidance and best practices for the electronics technical community of users, suppliers, testing facilities, government agencies as well as academia.
Standards development meetings at IPC APEX EXPO will advance industry specifications and guidelines in the areas of: assembly and joining; assembly equipment; base materials; cleaning and coating; electronic product data description; embedded devices; environment, health and safety (EHS); fabrication processes; flexible and rigid-flex printed boards; high-speed/high-frequency interconnections; management; packaged electronic components; printed board design technology; printed electronics; process control; product assurance; product reliability; rigid printed boards; terms and definitions; and testing.
For example, IPC’s Printed Electronics Test Method Development and Validation Subcommittee will meet with the Membrane Switch Subcommittee of ASTM to discuss current and future test methods for printed electronics. IPC’s Technology Roadmap Subcommittee will discuss new approaches that are currently in beta-testing for the biennial IPC International Technology Roadmap for Electronic Interconnections.
IPC’s newest standards group, the DFX Standards Subcommittee, will lay the foundation for a document and training course that will combine the best of existing IPC standards with manufacturability requirements from OEM and EMS Companies. Also, IPC’s Land Pattern Subcommittee will meet with the IPC-7070 Task Group to consider component mounting issues being addressed in two IPC standards: the soon-to-be IPC-7070 on component mounting (formerly CM-770) and IPC-7351 on surface mount design and land pattern.
More information on IPC-7070 and the DFX standard in development will be discussed at the Design Forum on Monday, March 24.
IPC APEX EXPO attendees can also learn about updates to new standards at a free BUZZ session (BZ2), “Promoting Excellence: New IPC Standards for Reliability and Quality,” on March 25. The session will cover IPC-9641 on high temperature printed board flatness; IPC-6013 which provides qualification and performance requirements for flexible printed boards; IPC-HDBK-830A on design, selection, and application of conformal coatings; and the first-ever standard on the manufacture, inspection and testing of electronic enclosures (box-build) IPC-A-630.
The complete schedule of standards development meetings is available at www.IPCAPEXEXPO.org/standards. Advance registration to attend standards development meetings is free. On-site registration is $50.
IPC APEX EXPO will also host the industry’s largest exhibition in North America, a technical conference, professional development courses, executive management meetings and a number of outstanding keynote sessions and networking activities. Attendees can save 52 percent off a la carte options by registering for the All Access Package. Early-bird savings of 20 percent is available through February 28. Visit www.IPCAPEXEXPO.org/register for more information.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,400 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
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