Oct 13, 2016 Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Session 4 on Thursday, October 27 will focus on “Customer Cleaning Challenges and Needs.”
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Terry Munson, President of Foresite Labs, will focus his presentation on low standoff cleaning comparison of aqueous batch, aqueous inline and vertical cleaning equipment.
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Haley Jones, R&D Chemist at KYZEN, will focus her presentation on cleaning agent corrosion potential on metals alloys common in the electronic assembly cleaning process.
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Wallace Ables, Supplier Quality Engineer at Dell, will focus his presentation on pitting and crevice corrosion potential of wave solder and selective solder flux residues.
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Gyan Dutt, Technical Marketing Manager at Alpha Assembly Solutions, will focus on LED Assembly reliability as a function of cleanliness.
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Karl Manske, Senior Technical Service Chemist at 3M, will focus his presentation on waterless PCB cleaning and coating in a single system.
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Eddie Hofer, M&P Engineer, and Dave Adams, Principal Materials & process Engineer at Rockwell Collins, will focus their presentation on the Cleaning Compatibility Standard being developed by the 5-31J IPC Task Group.
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Wendy Casker, Section Supervisor at Johns Hopkins University APL, will focus her presentation on an evaluation of solvent vs. aqueous cleaning processes using methods outlined by IPC Task Group 5-31J.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.The link http://www.ipc.org/calendar/2016/cleaning-coating/agenda.htm provides a detailed conference agenda.
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