Assembly Programming, Measurement & Inspection System

Smart Sonic Corporation is pleased to announce the new Assembly Module upgrade to our StencilScan� stencil and board inspection system. For only $3,000.00 the new Assembly Module upgrade integrates a powerful off-line programming, measurement and data creation capability to StencilScan�s unique inspection functions.

As an upgrade to StencilScan or as an independent system, the Assembly Module improves productivity and saves time and money by replacing cumbersome and complex CAM software packages and inaccurate, time-consuming manual inspection and programming methods with a sophisticated and user friendly Windows�-based system.

StencilScan�s Assembly Module produces assembly programs and process documentation for pick and place, insertion, test, inspection and dispensing machines with automatic centroid extraction. Or, scan components to generate measurement data for component libraries and vision files � no more calipers!

The Assembly Module also allows inspection and measurement of wet solder paste, adhesive and thick film materials. Even small material coverage for micro BGAs, wafer bumps and flip chips are easily imaged. StencilScan�s Assembly Module allows the operator to create stencil fabrication data, compare stencil to PCB, create assembly programs off-line, inspect and measure stencils, components, bare boards, loaded boards, and adhesive/solder paste/thick film deposition all in one user-friendly software package!

See the Assembly Module, StencilScan and GlueScan inspection, measurement and programming systems at APEX, Booth #3857

Or view them on the Smart Sonic Website: http://www.smartsonic.com