News Releases from Henkel Electronic Materials
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61 news releases added by Henkel Electronic Materials
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Henkel Develops Non-Proprietary Solder Paste Analysis Toolkit for Modern Process Complexities
Mar 16, 2018 | As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
Henkel to debut new materials, share expertise at IPC APEX Expo 2018
Jan 31, 2018 | Coming off a historic 2017 during which the electronics business of Henkel Adhesive Technologies launched over 50 new products and enjoyed significant sales wins, the company is poised to have a repeat performance this year. At IPC APEX Expo in San Diego, CA, the Henkel team will showcase a host of new products in booth # 3001 and share its knowledge base in paper presentations during the event’s conference.
TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award
Mar 06, 2017 | Last month at the IPC APEX Expo event in San Diego, California, Henkel’s TECNOMELT AS 8998 hot melt masking material was presented with a Circuits Assembly NPI award in recognition of its ability to meet several criteria, including: creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability. The award capped off what has been a successful first year for TECHNOMELT AS 8998, which was commercialized in early 2016 and has already lowered cost and improved operational efficiency at several global electronics manufacturers.
Steven Abramovich Appointed Head of Sales, Americas for Henkel’s Electronics Business
Mar 01, 2017 | Henkel Adhesive Technologies today announced that Steven Abramovich has been named Head of Sales, Americas for its electronics business. Previously Vice President of Channel Management for the company, Abramovich lends 30 years of results-driven sales and marketing experience to his new role.
Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications
Feb 23, 2017 | Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.
Henkel to Showcase Broad Range of Enabling Electronic Materials at IPC APEX Expo 2017
Jan 24, 2017 | At next month’s IPC APEX Expo (APEX) event in San Diego, California, Henkel Adhesive Technologies’ electronics business will display a full range of state-of-the-art electronic materials, all designed to push the conventional limits of performance capability. From February 14 through 16 in booth #1501, Henkel’s line of game-changing solder, encapsulant, underfill and thermal materials will be on show.
Broad Portfolio of Henkel Enabling Technologies on Show at SMTA International 2016
Sep 21, 2016 | From booth #936 at the upcoming SMTA International event in Rosemont, Illinois, Henkel Adhesive Electronics’ display will underscore why the company leads the market in comprehensive assembly materials technologies. With multi-award-winning LOCTITE GC solder materials, a broad range of leading-edge thermal management technologies, and new applications for TECHNOMELT products, the Henkel booth is the go-to destination for advanced electronics assembly materials.
Henkel Honors Manufacturing Representative, E-Tronix, with its Fifth North American Representative of the Year Award
May 11, 2016 | Henkel Adhesive Technologies’ Electronics business has named E-Tronix its 2015 North American Manufacturing Representative of the Year. This is the fifth time in six years that the company has earned this distinction, which Henkel awards to its top performing representative as measured against very stringent criteria.
Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America
May 09, 2016 | Henkel Adhesive Technologies’ Electronics business today announced a new distribution partnership with plastic film and adhesives solutions provider, Tekra, A Division of EIS, Inc. Under the terms of the agreement, Tekra will deliver sales, technical consultation and post-sale service for Henkel’s full line of electronic ink materials in support of customers throughout North America.
Henkel Develops Thermally Conductive Technomelt® Solution
Mar 30, 2016 | Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
New Technomelt® Material Streamlines Substrate Coating Processes
Mar 27, 2016 | Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Benoit Pouliquen to Lead Electronics Business of Henkel Adhesive Technologies
Mar 23, 2016 | Benoit Pouliquen has been appointed as Corporate Senior Vice President and Global Head of the Electronics business of Henkel Adhesive Technologies. He is succeeding Alan Syzdek who retired last year.
Henkel Leads Series C Investment in Vitriflex, Inc.; Reaffirms Commitment to Next-Generation Display Technologies
Jun 03, 2015 | Based on the strong, continued progress in developing customized, integrated barrier films for display applications, The Electronics Group of Henkel announced today that it has made an additional investment in ultra-barrier film technology innovator, Vitriflex, Inc. Henkel made its first equity investment and signed a joint development agreement (JDA) with the promising start-up company in May 2014. In this latest round, Henkel was the lead Series C investor.
Henkel Introduces Two Encapsulants Ideal for Sensitive Components
Mar 13, 2013 | Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, LOCTITE ECCOBOND UV9060F and LOCTITE ECCOBOND EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.
Henkel Debuts High-Reliability Pb-Free Solder Alloy for High-Temperature Applications
Mar 04, 2013 | Developed alongside and accepted by the automotive industry, Henkel Electronic Materials announces the commercial availability of 90iSC, a high-reliability, lead-free solder alloy for demanding high-temperature applications. The new alloy, which addresses the drawbacks certain products experience with traditional SAC alloys, has been proven as a viable lead-free solution for applications where extremely high reliability is required.
Henkel develops materials innovations for high power electronics
Apr 27, 2012 | Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.
Henkel Chipbonder Compatible with Non-Contact Dispensing Technology; Enables Higher Throughput and More Uniform Dot Dimensions
Apr 04, 2012 | Known worldwide for surface-mount adhesive (SMA) development leadership, Henkel has set the industry benchmark with its high-performance Chipbonder brand adhesives. Within the company’s expansive portfolio of SMAs is
Henkel Electronics Moves to New State-of-the-Art Headquarters in Irvine, California
Aug 17, 2010 | Henkel’s Adhesive Electronics business has relocated its headquarters to a new facility in Irvine, California which the company fully expects will help further its innovation initiatives.
Henkel reports substantial increase in sales and earnings in the second quarter
Aug 09, 2010 | “Following a very good start to fiscal 2010, we have now seen our operations continue their successful development in the second quarter, with our Adhesive Technologies and Cosmetics/Toiletries business sectors making a particularly strong contribution..."
Henkel’s Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology
Jul 29, 2010 | Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Sustainability is a Global Enterprise
Jul 08, 2010 | Between June 30 and July 2, the Board of Trustees for Sustainability at Arizona State University (ASU), USA met with international experts from industry, the sciences and the political scene for a conference and exchange of views, knowledge and experience. The topics discussed ranged from the role of multinational companies and political programs to sustainability science in higher education.
New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications
May 12, 2010 | Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Henkel makes a good start to the year
May 07, 2010 | Substantial increase in sales and profits in the first quarter.
Loctite PowerstrateXtreme Printable from Henkel Raises the Bar on Thermal Management Flexibility
May 04, 2010 | Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme Printable (PSX-P), a new print-friendly thermal management product.
Henkel’s Multicore LF620 Lead-Free Solder Paste Sets the New Benchmark for the Lead-Free Era
Apr 23, 2010 | Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Henkel Macromelt Portfolio Extended to Address Green & Portable Energy, Medical Applications: Selected by Big 3 Automaker for Next-Gen Vehicle
Apr 23, 2010 | World-renowned as the leading low-pressure molding solution, Henkel's popular Macromelt portfolio has now been extended to meet the requirements of Green and Portable Energy and Medical manufacturers.
Henkel Product Development Expertise Rewarded at APEX
Apr 16, 2010 | Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.
Henkel to Show Latest Materials Innovations at APEX 2010
Mar 17, 2010 | Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment – even throughout the recent downturn – has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources that are unmatched.
Henkel Extends Representative Network in the Americas
Dec 18, 2009 | onoring its commitment to deliver easy access to world-class materials solutions, Henkel Corporation’s electronics group today announced an extension of its representative network in the United States.
Henkel’s Multicore LF730 Raises the Bar on Lead-Free Solder Paste Performance
Dec 10, 2009 | Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Henkel Introduces Zero Halogen Multicore HF108 Solder Paste
Nov 24, 2009 | Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio
Nov 19, 2009 | Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
Henkel recovery continues through third quarter
Nov 14, 2009 | Consumer businesses continue their successful course – Adhesives business further improved versus previous quarters
Henkel Appoints New Manufacturer’s Representatives in Key US Regions
Nov 09, 2009 | Henkel Corporation’s electronics group has signed on two new representatives to support its sales initiatives in Northern California and the Texas/Oklahoma region. The firms, Moore Integrated Technologies and The NiMar Group, respectively, are both managed by industry professionals with a long and successful history in the electronics marketplace, thus upholding Henkel’s pledge to enable its customers’ success through expert, local and accessible sales support.
Simone Bagel-Trah New Chair of Henkel’s Shareholders’ Committee
Sep 26, 2009 | Today, the Shareholders’ Committee of Henkel AG & Co. KGaA elected Simone Bagel-Trah as its new Chairwoman. Bagel-Trah takes over this office from Albrecht Woeste who has been a member of the committee since 1976 and became its Chairman in 1990. This coming Tuesday, Simone Bagel-Trah is also due to be elected Chair of Henkel’s Supervisory Board. This completes the transition from the fourth generation of the Henkel family to the fifth. The change at the top of these two supervisory bodies had already been announced at the Henkel Annual General Meeting of spring 2008.
Sustainability: Henkel’s leading position confirmed
Sep 09, 2009 | International consumer goods manufacturer Henkel has once again been included as a leader in its sector in the Dow Jones Sustainability World Index. The Index lists corporations that follow the principles of sustainable development in their business operations.
Henkel’s Pioneering Ablestik® Self-Filleting® Die Attach Receives Notice that First Patent to Grant
Sep 09, 2009 | Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.
Henkel shows positive trend in Q2
Aug 07, 2009 | “Again in the second quarter of 2009, Henkel felt the effects of the continuing world economic recession. Nevertheless, all our business sectors were again able to outstrip their relevant markets,” said Kasper Rorsted, Chairman of the Henkel Management Board. “Our Laundry & Home Care business sector actually surpassed the good results of the first quarter, while Cosmetics/Toiletries again showed a very positive performance.
New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue
Jul 30, 2009 | In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices
Jul 24, 2009 | To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications
Jun 08, 2009 | Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.
Multicore LF700 Solder Paste from Henkel Offers Exceptional Lead-free, Halide-free Performance
Jun 02, 2009 | With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Henkel Launches Next-Gen Underfill that has it All
May 26, 2009 | In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Henkel Appoints Jim Wise to Lead Global Sales Efforts for Electronics Assembly Business
May 20, 2009 | In a move designed to further expand the company's market and sales leadership, Henkel Corporation has selected Mr. Jim Wise to direct the global sales effort for its electronics assembly business.
Rowan County Manufacturer to Add 103 Jobs State Grant Helps Henkel Corp. Expand in Salisbury
May 15, 2009 | RALEIGH � Gov. Bev Perdue today announced that Henkel Corp., an international supplier of adhesives and sealants for industrial, commercial and home use, plans to expand its Salisbury operations. The company plans to invest more than $23.7 million and to create 103 jobs during the next three years. The announcement was made possible in part by a $206,000 grant from the One North Carolina Fund.
Henkel affected by economic downturn
May 07, 2009 | �At the beginning of this new financial year, Henkel too has felt the effects of the persistently adverse economic climate, with our businesses turning in a very mixed set of results for the first quarter of 2009,� commented Kasper Rorsted, Chairman of the Henkel Management Board. �Our two consumer goods business sectors, Laundry & Home Care and Cosmetics/Toiletries, continued to perform very well, while the Adhesive Technologies business sector suffered from the challenges encountered in major customer industries worldwide.� Rorsted continued: �We are dissatisfied with our start to fiscal 2009. However, we are convinced that, as a result of our early introduction of countermeasures and based on our solid financial position, we will emerge from this still difficult economic environment stronger than before.�
Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul
Apr 09, 2009 | The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Sustainability as a success factor
Mar 06, 2009 | Global competition is posing new challenges for all market players. In meeting these challenges, it is becoming increasingly important to combine product performance with responsibility toward people and the environment. Henkel has already been working toward achieving sustainable development for more than 130 years. The company sees its sustainability strategy � which encompasses the entire value chain � as an opportunity to set itself apart from its competitors and offer added value to customers and consumers.
Henkel increases sales and earnings
Mar 02, 2009 | Business results reflect National Starch acquisition and Ecolab sale
Achievements internationally recognized
Feb 10, 2009 | Combining economic success with corporate social responsibility (CSR) has been a constant feature of Henkel's business philosophy for over 130 years now. And in international terms, too, Henkel counts among the leading companies in this domain. So when it came to conferral of the first ever �European Corporate Responsibility Award� in Prague on February 5 this year, Henkel was once again among the finalists.
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