News Releases from i3 Electronics
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26 news releases added by i3 Electronics
Company Information:
Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering
Dec 03, 2010 | Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award
Jul 08, 2008 | ENDICOTT, NY� Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region.
Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.
Jun 19, 2008 | ENDICOTT, N.Y.� Congressman Michael Arcuri, representing New York�s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.
Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction
May 12, 2008 | Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.
May 12, 2008 | Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31st, in a ceremony attended by business, political and community leaders.
Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board
Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).
Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions
Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.
Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).
Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has announced the appointment of Steven Burke to the position of chief financial officer for the company, a move that strengthens EI�s management team during a period of accelerating growth.
Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has named Sharon Pinto to the position of vice president, human resources effective immediately.
Endicott Interconnect Technologies' Wire Bond Product Launched into Space.
Nov 08, 2007 | Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract
May 30, 2007 | Endicott, NY� May 29, 2007. Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing.
Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies- Manufacturer Now Largest User of LDI Technology in the Americas
May 30, 2007 | Billerica, MA � May 24, 2007. Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.
Endicott Interconnect Technologies, Inc. Awarded Multiple Department of Defense Contracts Totaling $164M
Mar 27, 2007 | 03/27/2007
Endicott Interconnect Technologies, Inc. Appoints Vice President of Research & Development
Mar 14, 2007 | ENDICOTT, NY
Endicott Interconnect Technologies, Inc. Boosts Sales Infrastructure
Jan 05, 2007 | ENDICOTT, NY
Technological Leadership Continues to Differentiate Endicott Interconnect
Dec 05, 2006 | ENDICOTT, NY
Endicott Interconnect�s Markovich Receives the Northeast Regional Industrial Innovation Award
Oct 17, 2006 | ENDICOTT, NY
Endicott Interconnect Technologies, Inc. Appoints Director for Military and Defense Programs
Sep 12, 2006 | ENDICOTT, NY, September 12, 2006
Endicott Interconnect Technologies, Inc. to Participate at ECTC and IMAPS Conferences
May 31, 2006 | ENDICOTT, NY, May 30, 2006
Endicott Interconnect Technologies, Inc. Wins Silicon Valley Contracts
May 24, 2006 | ENDICOTT, NY, May 23, 2006
EI Honors Patent Recipients
Feb 15, 2006 | ENDICOTT, NY � January 31, 2006
Endicott Interconnect Partners with Technology Neighbor To Achieve Maximum Throughput of Complex Assemblies
Dec 14, 2005 | Endicott, NY
EI Wins Contracts To Supply Multiple Components for Raytheon Advanced 'Hawkeye' Program
Dec 14, 2005 | Endicott, NY - November 1, 2005
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