Feb 20, 2013 
Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego Convention Center in California.
In the development of SN100C P604 Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive and does not use any chemicals requiring special registration under the EU REACH legislation without compromising on performance or reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
