May 05, 2016 Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
The CRE6 is an optional module to the Akrometrix AXP shadow moiré system that allows a user to mirror the thermal environment of a reflow oven while conducting warpage metrology. The newest reflow emulator offered by Akrometrix, the CRE6 features increased heating/cooling rates and improved temperature uniformity.
Neil Hubble, Akrometrix’s Director of Engineering commented, “Akrometrix’s shadow moiré systems have become the industry standard for warpage measurement. With our CRE6, customers will be able to measure warpage on substrates up to 70mm (diameter) with sub-micron z-resolution in a convection reflow environment. Our aggressive heating rates of up to 5oC/second allow measurements from 25oC to 275oC with convective heating and tightly controlled thermal uniformity.”
Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at Sales@Akrometrix.com or visit www.Akrometrix.com.
