After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process Book online at https://www.bobwillis.co.uk/event/manual-cleaning-of-printed-board-assemblies-step-by-step-guide/
Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning. Book your webinar place with Bob Willis for a free set of cleaning defect wall charts