Company Information:
Mar 10, 2016 | Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Dec 13, 2015 | Photo Stencil announces that it has sold the Photo Stencil business in Guadalajara, Mexico to the facility's management team, Francisco Lujano and Armando Berumen. Photo Stencil's Mexico facility produces laser-cut stencils and will continue to sell both the laser-cut stencils they manufacture and electroform stencils that will be made by Photo Stencil in its new Golden, CO facility.
Oct 11, 2015 | Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Sep 30, 2013 | Free Session, Spotlight 4, October 16, 2013 from 9:30-11:00 AM