YINCAE Advanced Materials, LLC. News

YINCAE's DA158N Die Attach Materials withstanding -273°C

Mar 30, 2022 | YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Dec 22, 2021 | YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.

YINCAE's New SMT 158N Series withstanding -273°C

Feb 24, 2021 | YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Jan 21, 2021 | YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Aug 04, 2020 | I could not be happier with the performance everyone at YINCAE has shown throughout the ISO 9001:2015 certification process," said Dr. Wusheng Yin, CEO of YINCAE. "This certification has demonstrated our clear desire to always operate at the highest levels of quality and efficiency. This is not just recognition of our tireless efforts to put the best products and service available on the market but that we intend to do so in the future!" YINCAE anticipates that the ISO 9001:2015 certification will help the company: • Provide quality products to meet or exceed customer's needs, expectations and requirements • Build an organization culture to focus on continual improvement and innovation • Produce products that comply with relevant laws and regulations • Ensure reliable risk management using best preventive practices

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

Sep 05, 2019 | (Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics. The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

Sep 05, 2019 | (Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics. The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

YINCAE's New NC 256 Zero Residue Flux

Aug 19, 2019 | YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Jul 19, 2019 | (Albany, NY) July 16, 2019 We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement.

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

Jul 15, 2019 | (Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

IMAPS New England Symposium & Expo 2019 is just 4 weeks away! Visit YINCAE on May 7, 2019

Apr 10, 2019 | (Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

Mar 12, 2019 | (Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.

YINCAE at iMAPS New England

Dec 31, 2018 | YINCAE is attending iMAPS New England

YINCAE at iMAPS 2019- Boston

Dec 31, 2018 | YINCAE is attending iMAPS 2019- Boston!

YINCAE at IPC APEX EXPO 2019

Dec 28, 2018 | IPC APEX 2019 is 1 month away!

APEX 2019 starts January 26th! VISIT YINCAE BOOTH 1720

Nov 29, 2018 | (Albany, NY) 11/23/2018 – IPC APEX EXPO is 2 months away! The tradeshow will take place at San Diego Convention Center, in San Diego, CA., January 26-31, 2019. We at YINCAE hope you will stop by our booth in the North Hall to learn more about YINCAE and the innovative products we have to offer. At YINCAE, we create exclusive products that no other company has to offer, from highperformance coatings and adhesives, to electronic materials used in microchip and optoelectronic devices. We hope to see you there at the conference. Please visit us at booth # 1720! If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at www.yincae.com

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Sep 04, 2018 | YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

YINCAE at IWLPC 2018

Jul 19, 2018 | (Albany, NY) July 16, 2018: YINCAE is excited to announce that we will be attending the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition in San Jose, CA this year from October 23rd-25th at the Double Tree by Hilton. This conference brings together many of the top performers in the semiconductor industry and addresses all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 | (Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.

SEMICON WEST 2018 starts next Tue July 10th! VISIT YINCAE BOOTH 5269

Jul 03, 2018 | (Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.

YINCAE’S SMT 158A Receives High Praise

May 18, 2018 | As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

May 14, 2018 | The world's first commercial diamond filled underfill.

SEMICON WEST 2018 is in 1 Month! VISIT YINCAE BOOTH 5269

May 08, 2018 | SEMICON WEST 2018 is 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Apr 09, 2018 | (Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

SEMICON West is 3 months away! Visit YINCAE at Booth #5269

Mar 30, 2018 | Visit YINCAE at Booth #5269

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 | Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 | Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Feb 14, 2018 | Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Feb 08, 2018 | IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 | Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Jan 16, 2018 | Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 | (Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 | (Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

SMT 158UL Highly Filled Room Temperature Underfill

Jun 13, 2017 | YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

SMT 88UL Super-Fast Flow Room Temperature Underfill

Jun 06, 2017 | YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

Jun 05, 2017 | YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).

PRESS RELEASE: New Product Announcement

Jan 24, 2017 | BP 256 is YINCAE’s new ball attach adhesive product

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

Aug 24, 2016 | SMTA international is just a month away!

SMTA INTERNATIONAL is 2 MONTHS AWAY! VISIT YINCAE BOOTH # 129 September 27th & 28th

Jul 26, 2016 | SMTA International is 2 months away!

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Jun 22, 2016 | Visit YINCAE Booth 6448

YINCAE at ECTC in Las Vegas in 2 weeks!!

May 18, 2016 | ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

ECTC is 1 Month Away Visit YINCAE Booth 506

Apr 27, 2016 | ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.

YINCAE Advanced Materials at IMAPS NE Booth # 101

Apr 25, 2016 | IMAPS New England is 1 week away! VISIT YINCAE Booth # 101 Join Dr. Yin’s Presentation May 3rd, 1PM

IMAPS New England 2016

Apr 08, 2016 | IMAPS New England is 1 month away! VISIT YINCAE Booth Join Dr. Yin’s Presentation May 3rd, 1PM

IPC APEX 2016 is 2 months away!

Jan 18, 2016 | The IPC APEX EXPO 2016 hosted by the Las Vegas Convention Center from March 15th – 17th is only two months away! Featuring world-class educational opportunities with leaders in industry practice and research, this year’s Forward Thinking for Tomorrow’s Technology theme will offer unparalleled opportunities to access solutions to industry experts. We look forward to helping you to meet your challenges and invite you to stop by our Booth 1718 to learn more about the innovative products and custom solutions that we offer.

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant

Nov 18, 2015 | Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.

Solder Joint Encapsulant

May 13, 2015 | The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

SMT 158 -- A Underfill Solution for Miniaturization in Microelectronics

May 13, 2015 | The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Sep 22, 2014 | YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.

World’s Best Flip Chip Underfill: SMT 158 Series

Aug 12, 2014 | (Albany, NY) August 12, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new underfill products that enables fast flowing, excellent reliability, and use on several different applications. This combination of characteristics enables SMT 158 series to be the world’s best flip chip underfill.

News Releases from YINCAE Advanced Materials, LLC.

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