News Releases from Tresky AG
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4 news releases added by Tresky AG
Company Information:
Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps
Oct 18, 2013 | Tresky announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and exciting show.
Tresky Appoints NW Test Solutions Inc. as Its Newest Rep
Jun 25, 2013 | Tresky, announces that it has named NW Test Solutions Inc. as its newest rep, covering the Pacific Northwest.
Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics
Jun 20, 2013 | Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
Tresky to Display T-6000 Die Bonder at SEMICON West 2013
Jun 20, 2013 | Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.
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