Improving Yield and Reducing Filler Damage in Material Dispensing
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The objective of this presentation is to help manufacturing engineers increase throughput and improve dispensing yield by reducing filler damage and maintaining material quality. Specific topics that will be discussed include: • The overall role that yield costs play in achieving the lowest possible cost per part produced • Common dispensing challenges when using material fillers and factors that impact microsphere breakage • Important considerations when specifying an adhesive dispensing solution for highly viscous and/or abrasive materials. OverviewOver the last decade, automotive and aerospace manufacturers drive to enhance efficiency, improve part quality, and reduce costs has increased immensely. Adhesive dispensing systems play a critical role in achieving those goals, and as a result, they have emerged as one of the fastest growing automation devices in the production environment. When it comes to selecting a dispensing solution, many manufacturers use initial costs as the primary driver of their purchasing decision. However, yield costs often make up the dominant fraction of total cost of ownership (TCO). This is particularly the case in operations where expensive fluids are needed to bond dissimilar materials or seal exposed parts, as lost yield and downtime associated with an under-performing system can quickly exceed any initial savings. When utilizing microspheres as a filler for standard material formulations, one thing that can drastically reduce yield and dramatically inflate overall costs by increasing the number of defective units per shift is breakage. In fact, in some applications, a breakage rate of up to 80% can occur. The purpose of this webinar is to help you (the manufacturing engineer) reduce costs and improve yield by better understanding factors that contribute to microsphere breakage, including system operating pressure, pump choice, material agitation, recirculation, seals and surface finishing, and temperature. Other topics that will be discussed include common challenges faced by process and manufacturing engineers when using material fillers and important considerations when specifying a dispensing system for hollow glass microspheres. Key Take-Aways
This course is now over. Please contact us directly for more information: +1 770 218 0835 (sales.us@scheugenpflug-usa.com) |
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http://www.globalspec.com/click/go2event?type=details&eventId=2147&evtsrc=SMTnet |